From Wikipedia, the free encyclopedia. This article is about the material. For the process, see Soldering. Main article: Flux metallurgy. Main article: Solder alloys.
Oxford Dictionaries. Online Etymology Dictionary. Jones, Holbrook L. Horton, Henry H. Ryffel eds. Bibcode : JOM Lead-free electronics. Science and Technology of Advanced Materials.
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Manko Solders and soldering: materials, design, production, and analysis for reliable bonding. McGraw-Hill Professional. Retrieved 27 March DFR Solutions. Retrieved 23 October Code: Title Needleman; et al. An year follow-up report". The New England Journal of Medicine. Davis Alloying: understanding the basics.
ASM International. Tan Lead finishing in semiconductor devices: soldering. World Scientific. Microelectronic packaging. CRC Press. Puttlitz; Kathleen A. Stalter Handbook of lead-free solder technology for microelectronic assemblies. Nihon Superior Co. Manufacturing Processes. PHI Learning Pvt. Retrieved Walker Cambridge University Press. Soldering processes and equipment. Retrieved 20 August SMTA International. Retrieved 18 Oct Retrieved 1 Aug Retrieved on Hwang Modern solder technology for competitive electronics manufacturing.
Solder - Wikipedia
Frear; Steve Burchett; Harold S. Morgan; John H. Lau The Mechanics of solder alloy interconnects. Minges Electronic Materials Handbook: Packaging. Handbook of materials and techniques for vacuum devices. Forensic examination of glass and paint: analysis and interpretation. Messler Joining of materials and structures: from pragmatic process to enabling technology. Vacuum sealing techniques. Pfaender Schott guide to glass. Integrated circuit failure analysis: a guide to preparation techniques.
Vibration Fatigue Reliability of Lead and Lead-Free Solder Joint by FORM/SORM
John Wiley and Sons. Micro process engineering: fundamentals, devices, fabrication, and applications. Laurila, and J.
Kivilahti, Metallurgical factors behind the reliability of high-density lead-free interconnections, In: E. Suhir, C.kukorewahewi.gq
Lead-Free Solder Joint Reliability
Wong, and Y. Name: isbn Size: 1.
Format: PDF. Name: errata. Size: 8. Size: Name: article1. Name: article2.
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- Molecular Engineering of Nanosystems (Biological and Medical Physics, Biomedical Engineering).
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Name: article4. His technical interests include thermal, mechanical, structural and fatigue behavior of electronic materials, packages and assemblies, and the application of engineering principles to the physical design and manufacturing of electronic systems. He is the author of over forty technical papers, a frequent speaker at technical conferences, and has been an invited lecturer and instructor at various corporate events and professional venues in Asia, Europe and North America.
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